| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Testing Capability: Flying Probe Test, Aoi, X-ray, Ict;
Surface Finish: HASL Enig OSP Immersion Silver;
Mass Production Lead Time: 7-20days Adjusted by Product Complexity;
Customization Service: Available;
Dielectric Constant Range: 2.0-10.0 Customizable;
MOQ: 1PCS for Sample;
Max PCB Size: 400*600mm;
Copper Thickness: 1oz-5oz Customizable;
Technical Support: Support;
Impedance Control Accuracy: ±5% / ±10%;
Delivery Way: Express Delivery/Air Freight/Sea Freight;
Prototype Lead Time: 24h/48h/72h Urgent Service Optional;
Min Line Width&Space: 3.5/4mil;
Hole Copper Thickness: 20-35μm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask Type: Green;
Silkscreen: White;
Shipping: DHL, UPS, TNT, FedEx, etc;
Certificates: UL, RoHS, SGS, ISO9001;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Surface Treatment: Immersion Gold;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thickness: 2.0mm;
Copper Thickness: 2oz;
Shipping: DHL, UPS, TNT, FedEx, etc;
Certificates: UL, RoHS, SGS, ISO9001;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Delivery Time: 4 to 10 Days;
Surface Finishing: Immersion Gold;
Soldermask: Blue,Green,White,Black,Yellow,Red;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thickness: 2.0mm;
Copper Thickness: 2oz;
Shipping: DHL, UPS, TNT, FedEx, etc;
Certificates: UL, RoHS, SGS, ISO9001;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Surface Treatment: Immersion Gold;
Board Size: 90mm*70mm;
Silkscreen: White;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Board Size: Customized;
Board Color: Green/Black/Red/Yellow Customized;
Silkscreen Color: Green/Black/Red/Yellow Customized;
Design Improvement: Available;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Min.Line Width: 0.1mm;
Max.Panel Size: 1200*750mm;
Certificates: ISO, UL, SGS, RoHS;
Shipping Express: DHL, UPS, TNT, Aramex, FedEx;
|