| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Testing Capability: Flying Probe Test, Aoi, X-ray, Ict;
Surface Finish: HASL Enig OSP Immersion Silver;
Mass Production Lead Time: 7-20days Adjusted by Product Complexity;
Customization Service: Available;
Dielectric Constant Range: 2.0-10.0 Customizable;
MOQ: 1PCS for Sample;
Max PCB Size: 400*600mm;
Copper Thickness: 1oz-5oz Customizable;
Technical Support: Support;
Impedance Control Accuracy: ±5% / ±10%;
Delivery Way: Express Delivery/Air Freight/Sea Freight;
Prototype Lead Time: 24h/48h/72h Urgent Service Optional;
Min Line Width&Space: 3.5/4mil;
Hole Copper Thickness: 20-35μm;
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Type: Rigid Circuit Board;
Dielectric: Fr4 Tg180+R04350b;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Tg180+R04350b;
Insulation Materials: Organic Resin;
Product Name: HDI PCB Circuit Board;
Keywords: Printed Circuit Board;
Surface Finishing: Enig, HASL,OSP, etc;
Board Thickness: 0.6mm-4mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.3mm;
Layer Count: 1-40;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Modelnumber: PCB Clone;
Min Drill Hole Diameter: 0.01,0.1mm Or10 Mil;
Umber of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min Trace/Gap: 0.075mm or 3mil;
Board Size: Custom;
PCB Cutting: Shear,V-Score, Tab-Routed;
Silk Scre Enmin Line Width: 0.006 or 0.15mm;
Board Thickness: 0.2-4.0mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Solar Energy & Power Inverter;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Yuwei;
Product Name: Multilayer PCB;
Keywords: Heavy Copper Multilayer PCB for Solar Inverter;
Surface Finishing: Enig, HASL, OSP, Enepig, Gold Finger, etc.;
Board Thickness: 0.6mm-6.5mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.1mm;
Layer Count: 1-50L;
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