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Printed Circuit Board Assembly
US$0.15-10.00 / Piece

Multilayer PCBA Contract Manufacturing Printed Circuit Board Assembly for Bluetooth Speaker Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10 Pieces US$0.15-10.00 / Piece

Sepcifications

  • Type Flexible Circuit Board
  • Dielectric FR-4
  • Material Aluminum Covered Copper Foil Layer
  • Application Communication
  • Flame Retardant Properties V0
  • Mechanical Rigid Fexible
  • Processing Technology Customized
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand OEM/ODM
  • Transport Package Antistatic Package+Plastic Box and Carton Box
  • Specification Customized
  • Trademark Customized
  • Origin Shenzhen China
  • PCBA-Testing X-ray, Aoi
  • Processing Electrolytic Foil
  • SMT Capacity >2 Million Points/Day
  • DIP Capacity >100K Parts/Day
  • Certification RoHS, CCC, ISO
  • Min. Space of BGA +/- 0.3mm
  • Min.Pin Space of IC 0.3mm
  • Max.Precision of IC Assembly 0.03mm
  • Surface Finishing Lead-Free HASL
  • Number of Layers 4-10 Layer
  • Board Thickness 1.6mm

Product Description

MultiLayer PCBA Contract Manufacturing Printed Circuit Board Assembly for Bluetooth Speaker Product Description PCB Assembly Capability: Stencil Size: 736x736mm Minimum IC Pitch: 0.2mm Maximum PCB size: 1200x 500mm Minimum PCB thickness: 0.25mm Minimum chip size: 0201 (0.2x0.1)/0603 ...

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Printed Circuit Board Assembly Comparison
Transaction Info
Price US$0.15-10.00 / Piece US$0.50-0.90 / Piece US$0.50-0.90 / PCS US$0.10 / Piece US$0.20-0.50 / Piece
Min Order 10 Pieces 10 Pieces 1 PCS 1 Piece 1 Piece
Payment Terms T/T LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union
Quality Control
Product Certification RoHS, CCC, ISO - ISO,UL,RoHS - -
Management System Certification ISO9001:2015 - - - -
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Ucreate PCB;
Cooper Thickness: 1oz;
Silkscreen: White;
Solder Mask Type: Enig;
Board Thickness: 1.6mm;
Base Material Type: Fr4;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: Multilayer;
Copper Thickness: 2oz;
Condition: Original Made;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Board Layer: 4;
Board Thickness: 1.6mm;
Base: Fr4;
Soldermask Color: Green;
Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve;
PCB Testing: E-Testing, Flying Probe Testing;
Solder Mask Color: Green/White/Black/Blue/Red/Purple;
Quick Turn: 3 Working Days;
Lead Time: 6 Working Days;
Ipc Standards: Ipc Class II;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Layer Count: 12 Layer;
Board Mateiral: Fr4 1t180;
Size: 290*300mm;
Specialities: Controlled Impedance;
Surface Finish: Enig/2u'';
Soldermask Color: Matte Blue;
PCB Testing: E-Testing, Flying Probe Testing;
Ipc Standards: Ipc Class II;
Lead Time: 10 Working Days;
Fast Turn: 5 Working Days;
Supplier Name

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier