| Specification |
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1, 6mm);
Thermal Conductivity: 3W/M·K (Dielectric Layer);
Copper Foil: 70μm;
Tg: 150°C;
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Type: Rigid Circuit Board;
Base Material: Aluminum;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Silkscreen Color: Green/Black/Red Customized;
Board Color: White/Green/Black/Red/Blue Customized;
Min Track and Spacing: ≥3/3mil(0.076mm);
Min Network Track and Spacing: ≥6mil/8mil(0.15/0.20mm);
Min Hole(Drilling Machine): Min 0.2mm, Tolerance ±0.075mm;
Min Slot(Drilling Machine): 0.6mm, Tolerance±0.1mm;
Surface Treatment: HASL, HASL Lead Free, Enig, Immersion AG, Immersio;
Thermal Conductivity: 1.0 / 1.5 / 2.0 / 3.0 W/M·K Available;
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Type: Rigid Circuit Board;
Base Material: Aluminum;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Silkscreen Color: Green/Black/Red Customized;
Board Color: White/Green/Black/Red/Blue Customized;
Min Track and Spacing: ≥3/3mil(0.076mm);
Min Network Track and Spacing: ≥6mil/8mil(0.15/0.20mm);
Min Hole(Drilling Machine): Min 0.2mm, Tolerance ±0.075mm;
Min Slot(Drilling Machine): 0.6mm, Tolerance±0.1mm;
Surface Treatment: HASL, HASL Lead Free, Enig, Immersion AG, Immersio;
Thermal Conductivity: 1.0 / 1.5 / 2.0 / 3.0 W/M·K Available;
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Type: Rigid Circuit Board;
Base Material: Copper;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Silkscreen Color: White/Green/Black/Red Customized;
Board Color: White/Green/Black/Red/Blue Customized;
Min Track and Spacing: ≥3/3mil(0.076mm);
Min Network Track and Spacing: ≥6mil/8mil(0.15/0.20mm);
Min Hole(Drilling Machine): Min 0.2mm, Tolerance ±0.075mm;
Min Slot(Drilling Machine): 0.6mm, Tolerance±0.1mm;
Surface Treatment: HASL, HASL Lead Free, Enig, Immersion AG, Immersio;
Thermal Conductivity: 1.0 / 1.5 / 2.0 / 3.0 W/M·K Available;
Min Width: ≥0.6mm;
Min Height: ≥0.8mm;
Min Line Width: ≥0.1mm;
Spacing Between Solarmask and SMT Square: ≥0.2mm;
|
Type: Rigid Circuit Board;
Base Material: Copper;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Silkscreen Color: White/Green/Black/Red Customized;
Board Color: White/Green/Black/Red/Blue Customized;
Min Track and Spacing: ≥3/3mil(0.076mm);
Min Network Track and Spacing: ≥6mil/8mil(0.15/0.20mm);
Min Hole(Drilling Machine): Min 0.2mm, Tolerance ±0.075mm;
Min Slot(Drilling Machine): 0.6mm, Tolerance±0.1mm;
Surface Treatment: HASL, HASL Lead Free, Enig, Immersion AG, Immersio;
Thermal Conductivity: 1.0 / 1.5 / 2.0 / 3.0 W/M·K Available;
Min Width: ≥0.6mm;
Min Height: ≥0.8mm;
Min Line Width: ≥0.1mm;
Spacing Between Solarmask and SMT Square: ≥0.2mm;
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