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PCB
US$0.80-2.60 / Piece

Low-Caf Fr4 PCB Thermoelectric Turn Signal Module - 0.8mm Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.80-2.60 / Piece

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric MCPCB\Fr4\Bt
  • Flame Retardant Properties Customized
  • Mechanical Rigid Rigid
  • Processing Technology Delay Pressure Foil
  • Base Material Double-Sided/Multilayer Aluminum/Copper
  • Insulation Materials Customized
  • Model PCB
  • Brand Hongyu
  • Transport Package Sea/Land/Air Freight
  • Specification customized
  • Trademark hongyu
  • Origin Jiangxi, China
  • Board Thickness 0.8mm
  • Metal Core PCB T2 High Conductivity Copper(0.8mm)
  • Thermal Conductivity 398W/M·K (Dielectric Layer)
  • Copper Foil 35/35μm
  • Tg 150°C

Product Description

Product Description Specification NO. Project Conventional process capability Extreme process capability advantage 1 layer 1-10 10 2 Product Type MCPCB\FR4\BT MCPCB\FR4\BT * 3 Surface Treatment HASL/OSP/ENIG/Immersion Silver (IAg)/ Immersion Tin (Sn)/Gold Plating HASL/OSP/ENIG/Immersion Silver ...

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PCB Comparison
Transaction Info
Price US$0.80-2.60 / Piece US$1.00-4.00 / Piece US$1.00-4.00 / Piece US$1.00-4.00 / Piece US$1.00-4.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, Western Union LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification - ISO 9001/14001 - - ISO 9001/14001
Management System Certification ISO14001, ISO9001:2015, ISO45001:2018, Others Others Others Others Others
Trade Capacity
Export Markets Southeast Asia/ Mideast, Domestic North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: PCB;
Brand: Hongyu;
Board Thickness: 0.8mm;
Metal Core PCB: T2 High Conductivity Copper(0.8mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 35/35μm;
Tg: 150°C;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Test: Aoi/Spi/X-ray;
Packing: Carton;
Delivery: 7-15 Days Sample;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Custom: OEM/ODM;
Packing: Carton;
Delivery: 7-15 Days Sample;
Test: Aoi/Spi/X-ray;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Test: Aoi/Spi/X-ray;
Packing: Carton;
Delivery: 7-15 Days Sample;
Supplier Name

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier