| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hometech;
Delivery: 2 Weeks;
PCBA QC: X-ray,Aoi Test,Function Test(100% Test);
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Type: Rigid Circuit Board;
Base Material: Copper;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Silkscreen Color: White/Green/Black/Red Customized;
Board Color: White/Green/Black/Red/Blue Customized;
Min Track and Spacing: ≥3/3mil(0.076mm);
Min Network Track and Spacing: ≥6mil/8mil(0.15/0.20mm);
Min Hole(Drilling Machine): Min 0.2mm, Tolerance ±0.075mm;
Min Slot(Drilling Machine): 0.6mm, Tolerance±0.1mm;
Surface Treatment: HASL, HASL Lead Free, Enig, Immersion AG, Immersio;
Thermal Conductivity: 1.0 / 1.5 / 2.0 / 3.0 W/M·K Available;
Min Width: ≥0.6mm;
Min Height: ≥0.8mm;
Min Line Width: ≥0.1mm;
Spacing Between Solarmask and SMT Square: ≥0.2mm;
|
Type: Rigid Circuit Board;
Base Material: Copper;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Silkscreen Color: White/Green/Black/Red Customized;
Board Color: White/Green/Black/Red/Blue Customized;
Min Track and Spacing: ≥3/3mil(0.076mm);
Min Network Track and Spacing: ≥6mil/8mil(0.15/0.20mm);
Min Hole(Drilling Machine): Min 0.2mm, Tolerance ±0.075mm;
Min Slot(Drilling Machine): 0.6mm, Tolerance±0.1mm;
Surface Treatment: HASL, HASL Lead Free, Enig, Immersion AG, Immersio;
Thermal Conductivity: 1.0 / 1.5 / 2.0 / 3.0 W/M·K Available;
Min Width: ≥0.6mm;
Min Height: ≥0.8mm;
Min Line Width: ≥0.1mm;
Spacing Between Solarmask and SMT Square: ≥0.2mm;
|
Type: Rigid Circuit Board;
Base Material: Copper;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Silkscreen Color: White/Green/Black/Red Customized;
Board Color: White/Green/Black/Red/Blue Customized;
Min Track and Spacing: ≥3/3mil(0.076mm);
Min Network Track and Spacing: ≥6mil/8mil(0.15/0.20mm);
Min Hole(Drilling Machine): Min 0.2mm, Tolerance ±0.075mm;
Min Slot(Drilling Machine): 0.6mm, Tolerance±0.1mm;
Surface Treatment: HASL, HASL Lead Free, Enig, Immersion AG, Immersio;
Thermal Conductivity: 1.0 / 1.5 / 2.0 / 3.0 W/M·K Available;
Min Width: ≥0.6mm;
Min Height: ≥0.8mm;
Min Line Width: ≥0.1mm;
Spacing Between Solarmask and SMT Square: ≥0.2mm;
|
Type: Rigid Circuit Board;
Base Material: Copper;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Silkscreen Color: White/Green/Black/Red Customized;
Board Color: White/Green/Black/Red/Blue Customized;
Min Track and Spacing: ≥3/3mil(0.076mm);
Min Network Track and Spacing: ≥6mil/8mil(0.15/0.20mm);
Min Hole(Drilling Machine): Min 0.2mm, Tolerance ±0.075mm;
Min Slot(Drilling Machine): 0.6mm, Tolerance±0.1mm;
Surface Treatment: HASL, HASL Lead Free, Enig, Immersion AG, Immersio;
Thermal Conductivity: 1.0 / 1.5 / 2.0 / 3.0 W/M·K Available;
Min Width: ≥0.6mm;
Min Height: ≥0.8mm;
Min Line Width: ≥0.1mm;
Spacing Between Solarmask and SMT Square: ≥0.2mm;
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