Min. Order Reference FOB Price
1 Piece US$100,000.00-1,000,000.00 / Piece
Product Description
Product Description Product Usage: Integrated circuit wafer glue, BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV, MEMS, fingerprint identification; integrated circuit wafer rapid annealing. Features: 1. Integrated human-machine operating system, continuous automated production, high ...