What is Advanced Precision Wire Bonder for High-Power Device Packaging
Price
Min. Order Reference FOB Price
1 Piece US$70,000.00-100,000.00 / Piece
Sepcifications
- After-sales Service 7*24 Hours
- Condition New
- Speed High Speed
- Precision Precision
- Certification ISO
- Warranty 12 Months
- Automatic Grade Automatic
- Type High-speed Chip Mounter
- Transport Package Crate
- Specification 960mm (L) x 1400mm (W) x 1700mm (H)
- Trademark Himalaya
- Origin China
- Wire Cutter Front Cut / Rear Cut
- Wire Feed System Motorized with High Resolution Encoder Feedback
- Wire Loss Detection Encoder and Bond Power Detection Method
- Maximum Wire Length Tracking Real-Time Monitoring
- Bond Force Aluminum Wire: 50g - 1500g
- Power Supply 200-240V AC, 50-60 Hz, 2000W
- Weight 900 Kg
- Work Area X Axis: 300 mm
- Y Axis 300 mm
Product Description
Product Description Our advanced automated wire bonder is engineered for high-speed, high-reliability interconnections in semiconductor packaging. It features a robust long-gantry motion system with a spacious 300mm x 300mm work area, providing exceptional positioning accuracy of ±1µm ...
