What is Advanced Laser Trimming System for Semiconductor Wafer Processing
Price
Min. Order Reference FOB Price
1 Piece US$100,000.00-1,000,000.00 / Piece
Sepcifications
- After-sales Service Provided
- Function High Temperature Resistance
- Demoulding Pull Core
- Condition New
- Certification ISO
- Warranty Provided
- Automatic Grade Manual
- Installation Vertical
- Driven Type Electric
- Mould Life 300,000-1,000,000 Shots
- Transport Package Customized or Wooden Box Packaging
- Specification Standard Specifications
- Trademark Himalaya
- Origin China
- Wafer Size Compatibility 6", 8", 12"
- Laser Type UV, IR, or Green Laser (Wavelength Selectable)
- Accuracy +/- 1um or Better (Depends on Material)
- Trim Speed up to 1000 Resistors/Sec (Adjustable)
- Supported Materials Thin-Film, Thick-Film, Si, GaAs, etc.
- Control System PC-Based with Gui (Real-Time Monitoring)
- Measurement Feedback in-Situ Resistance Monitoring
- Applications Resistor Trimming, Mems Tuning, IC Repair
Product Description
Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation system isbased on precision laser trimming . The system is equipped with a fully ...
