How does Precision Semiconductor Wafer Dicing with Advanced Stealth Technology Work
Price
Min. Order Reference FOB Price
1 Set US$200,000.00-500,000.00 / Set
Sepcifications
- After-sales Service 1 Year
- Function High Temperature Resistance
- Demoulding Automatic
- Condition New
- Certification ISO
- Warranty 12 Months
- Automatic Grade Automatic
- Installation Desktop
- Driven Type Electric
- Mould Life >1,000,000 Shots
- Transport Package Customized or Wooden Box Packaging
- Specification Standard Specifications
- Trademark Himalaya
- Origin China
- OEM Yes
- Flatness of Cutter Face ≤0.002mm
- Reach Accuracy +0.003mm
- Minimum Measurement 0.5*0.5mm
- Central System Function Remove Machine Alarm Processing
- Cutting Substrate Si, Pkg, PCB etc
- Feature High Detection Capability
- Signal Reading Accurate
- Spindle Output Power 1.8kw(2.4kw)
- Spindle Speed Range 6000-60000rpm
Product Description
Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution This integrated solution is engineered for high-precision, high-efficiency, and high-yield processing of brittle silicon carbide materials. The system comprises three core pieces of equipment to handle the entire ...
