What is Laser Debonding & Wafer Cleaning Machine for Semiconductor Manufacturing
Price
Min. Order Reference FOB Price
1 Piece US$100,000.00-1,000,000.00 / Piece
Sepcifications
- After-sales Service 1 Years
- Function Abrasion Resistance, High Temperature Resistance
- Demoulding Automatic
- Condition New
- Certification ISO
- Warranty 12 Months
- Automatic Grade Automatic
- Installation Vertical
- Driven Type Electric
- Mould Life 300,000-1,000,000 Shots
- Transport Package Customized or Wooden Box Packaging
- Specification Standard Specifications
- Trademark Himalaya
- Origin China
- Product Name Laser Debonding
- Feature 1 Stripping and Cleaning Functions
- Feature 2 Real-Time Monitoring
- OEM/ODM Service Provided
Product Description
Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal damage Real-time monitoring and automatic compensation, ensuring process stability Providing wavelength- matching bonding adhesive ...
