| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Communication;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Products Name: 94V0 Fr4 PCB Circuit Board;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design, Engineering Support, Testing;
Specialised: Medical, Industrial, Communication, Controlboard;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test), 40X Om;
Surface Finishing: Enig, OSP, AG, Immersion Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black, Yellow, Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: LED;
Mechanical Rigid: Rigid;
Material: Aluminum;
Copper Thickness: 1/2 Oz;
Surface Finishing: Lf-Hal;
Solder Mask Type: Black;
Board Thickness: 1.0mm;
Min. Hole Size: 0.25mm;
Min Line Width: 0.075mm;
Layer: 1 to 24;
Package: Vacuum;
Shipping: DHL, FedEx, UPS, Ect;
PCB: Circuit Board;
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Type: Flexible Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Fexible;
Material: Aluminum;
Side: Double;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Width: 6mil;
Min. Line Spacing: 6mil;
Surface Finishing: Hal;
Soldermask: White;
Legend: Black;
Shipping: UPS, FedEx, DHL, Ect;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Copper Thickness: 2oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.1mm;
Min. Line Space: 0.075mm;
Min. Line Width: 0.075mm;
Solder Mask: Green;
Test: Aoi;
Package: Vacuum Package;
Small Order: Accept;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Al;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Board Thickness: 1.2mm;
Surface Finishing: Lf-Hal;
Soldermask: White;
Silkscreen: Black;
Copper Thickness: 1oz;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
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