| Specification |
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard Board;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design, Engineering Support, Testing;
Specialised: Medical, Industrial, Communication, Controlboard, LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test), 40X Om;
Surface Finishing: Enig, OSP, AG, Immersion Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black, Yellow, Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: LED Light;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Surface Treatment: HASL Lead Free/OPS;
Size: 500*8mm 500*10mm 500*12mm;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Computer with LCD Screen, Aviation and Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Copper Thickness: 1oz;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: LED;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Base Material Type: Polyimide;
Thickness: 0.15-0.2mm;
Size: 500*8mm;
Solder Mask Color: White/Black;
Surface Treatment: HASL Lead Free/OPS/Immersion Gold;
Ipc Standards: Ipc Class II;
Lead Time: 9 Working Days;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Medical Device;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Epoxy Resin;
Brand: Ucreatepcb;
Board Thickness: 0.2mm;
Soldermask: Black;
Surface Finish: Enig;
Panel Size: 230*160;
Lead Time: 9 Working Days;
Ipc Standards: Ipc Class II;
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