| Specification |
Type: IC Substrate;
Dielectric: Bt;
Material: Bt;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Bt;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: IC Substrate Board Bt Substrate PCB;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication, Consumer Electronics;
Flame Retardant Properties: V1, V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4, Copper;
Insulation Materials: Epoxy Resin, Organic Resin;
Brand: Fastline;
Board Thickness: 0.5mm-3mm;
Copper Thickness: 0.5oz-8oz;
Material Type: Fr4;
Surface Treatment: Enig;
Solder Mask: Green/White/Blue/ Black/ Red;
Silk Screen Color: White / Black;
Board Layer: 1-50 Layers;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
Supply: Fast;
Service: One-Stop;
Min Hole: 0.1mm;
Min Trace: 3/3mil;
MOQ: 1 PCS;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Board Thickness: 0.5mm-3mm;
Copper Thickness: 0.5oz-8oz;
Material Type: Fr4;
Surface Treatment: Enig;
Solder Mask: Green;
Silk Screen Color: White;
Board Layer: 1-26 Layers;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Board Thickness: 0.5mm-3mm;
Copper Thickness: 0.5oz-8oz;
Material Type: Fr4;
Surface Treatment: Enig;
Solder Mask: Green;
Silk Screen Color: White;
Board Layer: 1-26 Layers;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Flexible Rigid Printed PCB Circuit Board;
MOQ: 1 PCS;
Layer: 1-24 Layer;
Min Hole Size: 0.1mm (4 Mil);
Copper Thickness: 0.5 Oz-3oz (18 Um-385 Um);
Board Thickness: 0.2mm-4mm;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Service: Flexible Rigid PCB/PCBA/SMT/DIP;
Other Service: PCBA Layout and Design, Engineering Support;
Test Service: E-Test, Aoi, X-ray, Function Test;
Specialised: Medical, Industrial, Control Board, Ce;
Delivery: PCB, 3-5 Days;PCBA, 2-3weeks;
Product Name: Flexible Rigid Printed PCB Circuit Board;
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