| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Communication;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Products Name: 94V0 Fr4 PCB Circuit Board;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: AIN;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Application: Computer;
Mechanical Rigid: Rigid;
Material: Aluminum;
Copper Thickness: 1oz;
PCB Solder Mask: White;
PCB Silkscreen: Black;
PCB Board Thickness: 1.6mm;
PCB Surface Finishing: HASL;
Min Hole Size: 0.2mm;
Min Line: 0.15mm;
Size: 10-1000mm;
Delivery Time: 1-7days;
Pack: Vacuum Packing;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Al;
Material: Aluminum;
Brand: Xjy;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Surface Finishing: Lf-Hal;
Solder Mask Type: White;
Silkscreen: Black;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.2mm;
Min. Line Spacing: 0.2mm;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Al;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Fexible;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Xjy;
Copper Thickness: 1oz;
PCB Silk Screen: Black;
PCB Surfaceing: HASL;
PCB Thickness: 1.0mm;
Min Hole Size: 0.2mm;
Min Line: 0.16mm;
Pack: Vacuum Packing;
Size: 10-1000mm;
Solder Mask: White;
Min. Line Spacing: 0.2mm;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Al;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Medical Instruments;
Mechanical Rigid: Fexible;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Xjy;
Copper Thickness: 25um;
Board Thickness: 1.2mm;
Min. Hole Size: 0.1mm;
Min. Line Width: 0.25mm;
Min. Line Spacing: 0.25mm;
Surface Finishing: OSP;
Layer: 1;
Solder Mask: White;
Legend Mask: Black;
|