| Specification |
Usage: Server;
Type: Custom;
Support Network: Custom;
Information content: Data;
Condition: New;
Machine Type: Hot Chamber Die Casting Machine;
Casting Method: Precision Die Casting;
Application: Communication Equipment, Data Center Hardware;
Machining: CNC Precision Machining & Tapping;
Material: Zinc Alloy (Zamak 3 / Zamak 5);
Surface Prep: Nickel Plating, Sand Blasting;
Pressure Chamber: Horizontal;
Tolerance Grade: CT4-CT5;
Surface Quality: Grade 1;
Specification 2: Compliant with Qsfp-Dd Msa Standard;
Form Factor: Osfp (Octal Small Form-Factor Pluggable);
Connector Compatibility: MPO-12 APC Connectors;
Power Consumption: Optimized for < 8W Applications;
Operating Temperature: Commercial Grade: 0°C to +70°C;
Shielding Performance: Superior EMI/Rfi Shielding for High-Speed Signals;
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Usage: Server, Switch, Telecom, Data Centre;
Type: Wired;
Support Network: Ethernet;
Information content: Data;
Condition: New;
Place of Origin: Guangdong, China;
Product Name: Fast Ethernet Fiber Media Converter;
Use: Optical Networks/FTTH/ Government House etc.;
Data Rate: 10/100/1000Mbps;
Device Type: Unmanaged;
Form Factor: Stand-Alone;
Copper Interface: 1X 10/100/1000base-Tx;
Fiber Interface: 1X 1000base-Fx;
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Usage: Telephone, Computer, Workstation, Server, Mobile phone, Laptop;
Type: Wired;
Support Network: Other;
Information content: Other;
Condition: New;
Cuda Cores: 2048;
Tensor Cores: 64;
Ai Performance: 275 Tops (Int8);
Memory: 64GB/32GB 256-Bit Lpddr5X 204.8GB/S;
Power: 15W - 40W - 60W;
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Usage: Server, Switch, Telecom, Data Centre;
Type: Wired;
Support Network: Ethernet;
Information content: Data;
Condition: New;
Place of Origin: Guangdong, China;
Product Name: Unmanaged Fast Ethernet Fiber Media Converter;
Use: Optical Networks/FTTH/ Government House etc.;
Data Rate: 10/100Mbps;
Device Type: Unmanaged;
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Usage: Telephone, Computer, Workstation, Server, Mobile phone, Laptop, FTTH;
Type: ONU;
Condition: New;
Architecture: Hopper;
Manufacturing Process: Tsmc 4n;
Transistor Count: 80 Billion;
Cuda Cores: 14,592;
Tensor Cores: 456;
Memory Type: Hbm2e;
Memory Capacity: 80GB;
Warranty: 12months;
Chipset Manufacturer: Nvidia;
Memory Bandwidth: 3tb/S (Sxm Version); 2tb/S (Pcie;
Chip: Nvidia;
Interconnect: Nvlink: 900GB/S (Sxm Version); 600GB/;
Fp64 Performance: 30 Teraflops (Sxm Version); 24 Te;
Fp64 Tensor Core Performance: 60 Teraflops (Sxm Ver;
Bf16 Tensor Core Performance: 2,000 Teraflops* (Sxm;
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