| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Service: One-Stop Turnkey Service;
Model Number: Tandard;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Material: Fr-4, High Frequency PTFE, Aluminum, Copper, Thick;
Copper Thickness: 1-10oz;
Solder Mask Color: Green, Yellow, White, Blue, Black, Red...;
Place of Origin: China;
Type: Channel Digital Amplifier;
Assembly Details: 6 SMT + 4 DIP (Dust and Anti-Static Lines);
Description: Printed Circuit Board Assembly;
Testing Service: Aoi, 100% E-Test;
Best Price: Please Contact Us;
Shipping by: DHL\UPS\FedEx\EMS\TNT\Aramex;
Lead Time: Lead Time;
Payment: Paypal\Tt\Western Union\ Trade Assurance;
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
|
Metal Coating: PCBA;
Mode of Production: PCBA;
Layers: PCBA;
Base Material: PCBA;
Customized: Customized;
Condition: New;
PCBA: Customized PCBA;
Solution: Customized PCBA;
Design: Customized PCBA;
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135, Tg150, Tg170, Tg180, Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP, Enig, Enepig, Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White, Orange;
PCBA-Testing: Aoi, X-ray, Function Test;
Delivery Time: Within 3 Days(Sample);
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135, Tg150, Tg170, Tg180, Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP, Enig, Enepig, Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White, Orange;
PCBA-Testing: Aoi, X-ray, Function Test;
Delivery Time: Within 3 Days(Sample);
|