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PCB Design
US$0.10-0.99 / Piece
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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-98 Pieces US$0.99

99-999 Pieces US$0.66

1,000+ Pieces US$0.10

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties HB
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand Customized
  • Transport Package Cardboard Box
  • Specification 5000pcs
  • Trademark caga
  • Origin China

Product Description

Tailored PCB Design with Customer-Specific Test Point Placement Professional PCB OEM with Expert Quality Control Specification Innovative Design Technical Highlights Feature Specification Bluetooth Version 5.3 (20m range) Driver Type Graphene-coated MEMS speakers Water Resistance IP67 (heavy ...

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PCB Design Comparison
Transaction Info
Price US$0.10-0.99 / Piece Negotiable US$0.01-0.30 / Piece US$0.01-0.30 / Piece US$0.99-20.00 / Piece
Min Order 10 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification - ISO9001, ISO14000, Ts16949.UL.RoHS - - -
Management System Certification ISO9001:2015 - - - -
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue - - - - -
Business Model ODM - - - ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Type: Combining Rigid Circuit Board;
Dielectric: SIC;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: OEM ODM;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Condition: New;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Flex-Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.1mm;
Copper Thickness: 35um;
Surface Finish: Enig;
Solder Mask: Coverlay;
Legend: Without;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Flex-Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.1mm;
Copper Thickness: 35um;
Surface Finish: Enig;
Solder Mask: Coverlay;
Legend: Without;
Type: PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Unice;
Layer: 1-20;
Finished Outer Copper Thickness: H/H0z-5/50z;
Supplier Name

Huzhou Ganchuang Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Okey Circuit Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier