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OEM/ODM One-Stop Turnkey PCB Factory
US$0.39-0.57 / Piece
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What is OEM/ODM One-Stop Turnkey Fr4 Eniig HDI Multilayer PCB Circuit Board with High Precision Mass Manufactory Fast Prototype Reverse Engineering No MOQ

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.57

1,000-4,999 Pieces US$0.52

5,000-9,999 Pieces US$0.43

10,000+ Pieces US$0.39

Sepcifications

  • Structure Double-Sided FPC, Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Fr4, Polyester Glass Fiber Mat Laminate
  • Application Medical Instruments
  • Flame Retardant Properties HB
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Fr4, Copper
  • Insulation Materials Epoxy Resin, Organic Resin
  • Transport Package Vacuum +Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Combination Mode Without Adhesive Flexible Plate
  • Conductive Adhesive Conductive Silver Paste
  • Board Material Fr4
  • Board Layer 2
  • Board Thickness 0.2 mm
  • Copper Thickness 1 Oz
  • Solser Mask Green
  • Silkscreen White
  • Surface Finishing Enig
  • Lead Time 4-5 Working Days
  • Shipping Type DHL.TNT, EMS, FedEx, UPS etc
  • PCB Design Custom Design Product

Product Description

OEM/ODM One-Stop Turnkey fr4 ENIIG HDI Multilayer PCB Circuit Board with High Precision Mass Manufactory Fast Prototype Reverse engineering No MOQ Company Profile Fastline Circuits is capable of providing full turnkey and partial turnkey printed circuit board assembly services. For full ...

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OEM/ODM One-Stop Turnkey PCB Factory Comparison
Transaction Info
Price US$0.39-0.57 / Piece US$0.90-99.99 / PCS Negotiable US$0.90-99.99 / PCS US$0.90-99.99 / PCS
Min Order 1 Piece 1 PCS 50 Square Meters 1 PCS 1 PCS
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment Small-amount payment, Western Union, PayPal, D/P, T/T, LC LC, T/T Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - 13,007,380.76 RMB - -
Business Model - ODM, OEM Own Brand, ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Structure: Double-Sided FPC, Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4, Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Epoxy Resin, Organic Resin;
Combination Mode: Without Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Board Material: Fr4;
Board Layer: 2;
Board Thickness: 0.2 mm;
Copper Thickness: 1 Oz;
Solser Mask: Green;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Design: Custom Design Product;
Structure: Double-Sided Rigid PCB;
Dielectric: Tly-5z;
Material: Composites of Ceramic, PTFE and Woven Fiberglass;
Application: Aerospace Components;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Immersion Gold;
Laminate Thickness: 50mil;
Layer Count: Double Sided;
Solder Mask: Green;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: PTFE;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Size: Customization;
Tensile Strength: Excellent;
Structure: Double-Sided Rigid PCB;
Dielectric: RO4535;
Material: Ceramic-Filled, Glass-Reinforced Hydrocarbon;
Application: Antenna;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Immersion Gold;
Laminate Thickness: 30mil;
Layer Count: Double Sided PCB;
Dielectric Constant: 3.44;
Structure: Multilayer Rigid PCB;
Dielectric: RO4535;
Material: Ceramic-Filled, Glass-Reinforced Hydrocarbon;
Application: Antenna;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Immersion Gold, Silver and Tin;
Laminate Thickness: 60mil 30mil 20mil;
Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB;
Dielectric Constant: 3.44;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shandong Senrong New Materials Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier