| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Customized;
PCB Layer: 1-26 Layers;
Solder Mask: Green, Black, Red;
Silk Screen: White;
Surface Treatment: HASL;
PCB Assembly Type: SMT and DIP;
PCB Service: One Stop Service;
Small Orders: Accepted;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Lead Time: 12-20 Days;
Testing: 100%;
Laser Drilling Hole Size: 0.1mm;
Outline Tolerance: ±0.10mm;
Packaging: Carton + Vacuum;
Impedance Control V-Scoring: ±10%;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized PCB Board;
Condition: New;
Product Name: Customized PCB Board;
Keywords: Electronic Circuit Board;
PCB Portfolio: 1-20 Layers, Standard, HDI, High-Tg, RF Pcbs;
Copper Thickness: 0.5 Oz, 1 Oz, 1.5 Oz, 2 Oz, 3 Oz;
Basic Material: Fr4, Modified Epoxy, Polyimide, PTFE, Glass, Al;
Board Thickness: 0.2-5.0 mm or Customized;
Min. Width/Space: 0.075 mm or Customized;
Min. Sm Bridge: 0.1 mm or Customized;
Min. Hole Dia: 0.1 mm or Customized;
Thickness Tolerance: 8%;
Board Outline Tolerance: 0.15mm;
SMD Pitch: 0.3mm;
Service: One-Stop OEM Service;
Max. Stencial Size: Customized;
Surface Treatment: HASL/OSP/AG/Enig/Enepig/Immersion Silver/Tin;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
|
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
|
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
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