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16 Layer HDI Multilayer PCB Board
US$1.08-5.26 / Piece
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What is High Frequency 16 Layer HDI Multilayer PCB Board for Smart Electronics Fast Turnkey OEM/ODM PCB Assembly & Manufacturing Factory

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

50-99 Pieces US$5.26

100-999 Pieces US$3.25

1,000+ Pieces US$1.08

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Enig
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Brand Fastline
  • Transport Package Vacuum Packing
  • Specification Certificates: UL, ROHS
  • Trademark FL
  • Origin China
  • Board Material Fr-4 (Tg 135 )
  • Board Thickness 1.6 mm
  • Copper Thickness 1 Oz (35um)
  • Surface Treatment HASL Lead Free
  • Solder Mask Green
  • Silk Screen White
  • Flying Probe Test Yes
  • Supplier Manufacturer
  • Layers 1-50L
  • Thicknees 1oz/2oz
  • Test 100% Test
  • Thickness 1 Oz/2oz
  • Certification UL/CE/CCC/ISO9001
  • Lead Time 6-15 Days
  • Service Fast-Prototype

Product Description

High Frequency 16 Layer HDI Multilayer PCB Board for Smart Electronics | Fast Turnkey OEM/ODM PCB Assembly &Manufacturing Factory Fastline Circuits Co., Limited, a leading PCB/PCBA contract manufacturer in China since 2006, specializes in delivering tailored manufacturing solutions to global ...

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16 Layer HDI Multilayer PCB Board Comparison
Transaction Info
Price US$1.08-5.26 / Piece US$0.90-2.60 / Piece US$0.90-2.60 / Piece US$0.90-2.60 / Piece US$0.90-2.60 / Piece
Min Order 50 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment - - - -
Quality Control
Product Certification UL/CE/CCC/ISO9001 - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast - - - -
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
- - - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Board Material: Fr-4 (Tg 135 );
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
Solder Mask: Green;
Silk Screen: White;
Flying Probe Test: Yes;
Supplier: Manufacturer;
Layers: 1-50L;
Thicknees: 1oz/2oz;
Test: 100% Test;
Thickness: 1 Oz/2oz;
Lead Time: 6-15 Days;
Service: Fast-Prototype;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr-4, Aluminum, Cem-1, Rogers, High-Tg Fr-4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Customized;
Product Name: Custom PCB Board;
Keywords: Printed Circuit Board;
Layer Count: 1-32 Layers;
Board Thickness: 0.4mm - 3.2mm(Customized);
Copper Weight: Inner: 0.5oz - 3oz / Outer: 0.5oz - 6oz;
Min. Trace/Space: 3mil/3mil (0.075mm);
Min. Hole Size: 0.2mm(Customized);
Surface Finish: HASL Lead-Free, Enig, OSP, Immersion Silver, Hard;
Solder Mask / Silkscreen Color: Customized;
Special Process: Blind/Buried Vias, Impedance Control, Gold Fingers;
Testing: Flying Probe Test, E-Test, Aoi, X-ray Inspection;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr-4, Aluminum, Cem-1, Rogers, High-Tg Fr-4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Customized;
Product Name: Custom PCB Board;
Keywords: Printed Circuit Board;
Layer Count: 1-32 Layers;
Board Thickness: 0.4mm - 3.2mm(Customized);
Copper Weight: Inner: 0.5oz - 3oz / Outer: 0.5oz - 6oz;
Min. Trace/Space: 3mil/3mil (0.075mm);
Min. Hole Size: 0.2mm(Customized);
Surface Finish: HASL Lead-Free, Enig, OSP, Immersion Silver, Hard;
Solder Mask / Silkscreen Color: Customized;
Special Process: Blind/Buried Vias, Impedance Control, Gold Fingers;
Testing: Flying Probe Test, E-Test, Aoi, X-ray Inspection;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr-4, Aluminum, Cem-1, Rogers, High-Tg Fr-4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Customized;
Product Name: Custom PCB Board;
Keywords: Printed Circuit Board;
Layer Count: 1-32 Layers;
Board Thickness: 0.4mm - 3.2mm(Customized);
Copper Weight: Inner: 0.5oz - 3oz / Outer: 0.5oz - 6oz;
Min. Trace/Space: 3mil/3mil (0.075mm);
Min. Hole Size: 0.2mm(Customized);
Surface Finish: HASL Lead-Free, Enig, OSP, Immersion Silver, Hard;
Solder Mask / Silkscreen Color: Customized;
Special Process: Blind/Buried Vias, Impedance Control, Gold Fingers;
Testing: Flying Probe Test, E-Test, Aoi, X-ray Inspection;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr-4, Aluminum, Cem-1, Rogers, High-Tg Fr-4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Customized;
Product Name: Custom PCB Board;
Keywords: Printed Circuit Board;
Layer Count: 1-32 Layers;
Board Thickness: 0.4mm - 3.2mm(Customized);
Copper Weight: Inner: 0.5oz - 3oz / Outer: 0.5oz - 6oz;
Min. Trace/Space: 3mil/3mil (0.075mm);
Min. Hole Size: 0.2mm(Customized);
Surface Finish: HASL Lead-Free, Enig, OSP, Immersion Silver, Hard;
Solder Mask / Silkscreen Color: Customized;
Special Process: Blind/Buried Vias, Impedance Control, Gold Fingers;
Testing: Flying Probe Test, E-Test, Aoi, X-ray Inspection;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Huizhou Chuangpu Electronics Co., Ltd.

Diamond Member

Huizhou Chuangpu Electronics Co., Ltd.

Diamond Member

Huizhou Chuangpu Electronics Co., Ltd.

Diamond Member

Huizhou Chuangpu Electronics Co., Ltd.

Diamond Member