| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 1-50;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
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Type: Flexible Circuit Board;
Dielectric: PTFE Polyimide Glass Fabric Copper-Clad Laminates;
Material: Tb-73 Polyimide;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Enepig;
Base Material: Polyimide (Tb-73);
Insulation Materials: Tb-73 (Serving as The Dielectric Material);
Brand: Rogers;
Designation: Tb-73;
Surface Finish: OSP, Enepig;
Copper Weight: 1oz (35µm), 2oz (70µm);
Solder Mask: Green, Black, Blue, Red, Yellow;
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Type: Rigid Circuit Board;
Dielectric: RO4003c;
Material: Fiberglass Epoxy;
Application: Automotive Radar and Sensors;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Brand: Rogers;
Tihickness: 8mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
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Type: Rigid Circuit Board;
Dielectric: Clte-Xt (PTFE-Based Composite);
Material: Clte-Xt;
Application: High-Performance Microwave and RF Applications;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Clte-Xt (Glass Epoxy);
Insulation Materials: Clte-Xt (Serving as The Dielectric Material);
Brand: Rogers;
Board Type: Rigid PCB;
Surface Finish: Immersion Gold, 43.57%;
Type of Artwork to Be Supplied: Worldwide, Globally;
Via: Plated Through Hole(Pth), Minimum Size 0.4mm;
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Type: Rigid Circuit Board;
Dielectric: Tmm4;
Material: Ceramic, Hydrocarbon and Thermoset Polymer;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Tmm4;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Application Thickness Mil: Stripline and Microstrip;
Copper Weight: 1oz or 2 Oz;
Solder Mask: Green, Black, Blue, Yellow, Red etc.;
Dielectric Constant: 4.5 ±0.045;
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