| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 6 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
PCB Design: Custom Design Product;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
Board Material: Fr4;
|
Type: LED Circuit Board;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Product Category Entity: Custom LED Printed Circuit Board;
Supported Board Types: Aluminum Core PCB, Copper Core PCB;
Supported Board Type: Thermoelectric Separation MCPCB, High-Tg Fr-4 LED;
Supported Layer Count: 1-4 Layer Metal Core & Hybrid Thermal Substrates;
Base Metal Core Material: Aluminum Alloy (5052 / 6061), High-Tg Fr-4;
Base Metal Core Materials: Oxygen-Free Copper (C1100);
Finished Board Thickness: 0.80 mm - 3.20 mm (±10%);
Base Copper Weight: 1.0 Oz - 6.0 Oz Heavy Copper Thermal Traces;
Min Line Width / Space: 0.075 mm / 0.075 mm (3 Mil / 3 Mil);
Min Drilling Hole Size: 0.20 mm (8 Mil) Mechanical / Laser Punching;
Solder Mask Options: High-Reflectivity Super White (>88%);
Surface Finish Options: HASL Lead-Free, Enig, OSP;
Breakdown Voltage (Dielectric): ≥ 3000V AC to 6000V AC High-Voltage Isolation;
Flammability Standard: UL 94V-0 Standard Compliant;
Acceptability Standard: Ipc-a-600 Class 2 & Ipc Class 3 (Automotive);
|
Type: LED Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4, Polyimide, Aluminum;
Insulation Materials: Organic Resin;
Board Type: Rigid, Flex, Rigid-Flex PCB;
Layer Count: 1 - 32 Layers;
Board Thickness: 0.2 mm - 3.2 mm;
Board Thickness Tolerance: ±10% (Min ±0.03 mm);
Finished Copper Weight: 0.5 Oz - 6.0 Oz (18-210 μm);
Min Line Width / Space: 0.05 mm / 0.05 mm (2 Mil);
Min Hole Size: 0.15 mm (6 Mil);
Surface Finish: Enig, HASL, OSP, Immersion Silver;
Solder Mask Color: Green, Blue, Black, White, Red;
Impedance Control: ±8% (50 ω, 100 ω Differential);
Operating Temperature Range: -40 °C to +130 °C;
Flammability Rating: UL 94V-0;
Dielectric Constant (Dk): 3.8 - 4.5 @ 1 GHz;
Testing Standard: 100% Aoi & Flying Probe Test;
Certifications: ISO 9001, IATF 16949, UL, RoHS;
|
Type: LED Circuit Board;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Product Category Entity: Custom LED Printed Circuit Board;
Supported Board Types: Aluminum Core PCB, Copper Core PCB;
Supported Board Type: Thermoelectric Separation MCPCB, High-Tg Fr-4 LED;
Supported Layer Count: 1-4 Layer Metal Core & Hybrid Thermal Substrates;
Base Metal Core Material: Aluminum Alloy (5052 / 6061), High-Tg Fr-4;
Base Metal Core Materials: Oxygen-Free Copper (C1100);
Finished Board Thickness: 0.80 mm - 3.20 mm (±10%);
Base Copper Weight: 1.0 Oz - 6.0 Oz Heavy Copper Thermal Traces;
Min Line Width / Space: 0.075 mm / 0.075 mm (3 Mil / 3 Mil);
Min Drilling Hole Size: 0.20 mm (8 Mil) Mechanical / Laser Punching;
Solder Mask Options: High-Reflectivity Super White (>88%);
Surface Finish Options: HASL Lead-Free, Enig, OSP;
Breakdown Voltage (Dielectric): ≥ 3000V AC to 6000V AC High-Voltage Isolation;
Flammability Standard: UL 94V-0 Standard Compliant;
Acceptability Standard: Ipc-a-600 Class 2 & Ipc Class 3 (Automotive);
|
Type: LED Circuit Board;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Product Category Entity: Custom LED Printed Circuit Board;
Supported Board Types: Aluminum Core PCB, Copper Core PCB;
Supported Board Type: Thermoelectric Separation MCPCB, High-Tg Fr-4 LED;
Supported Layer Count: 1-4 Layer Metal Core & Hybrid Thermal Substrates;
Base Metal Core Material: Aluminum Alloy (5052 / 6061), High-Tg Fr-4;
Base Metal Core Materials: Oxygen-Free Copper (C1100);
Finished Board Thickness: 0.80 mm - 3.20 mm (±10%);
Base Copper Weight: 1.0 Oz - 6.0 Oz Heavy Copper Thermal Traces;
Min Line Width / Space: 0.075 mm / 0.075 mm (3 Mil / 3 Mil);
Min Drilling Hole Size: 0.20 mm (8 Mil) Mechanical / Laser Punching;
Solder Mask Options: High-Reflectivity Super White (>88%);
Surface Finish Options: HASL Lead-Free, Enig, OSP;
Breakdown Voltage (Dielectric): ≥ 3000V AC to 6000V AC High-Voltage Isolation;
Flammability Standard: UL 94V-0 Standard Compliant;
Acceptability Standard: Ipc-a-600 Class 2 & Ipc Class 3 (Automotive);
|
