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Speaker Main Control Board PCB
US$2.78-4.69 / Piece
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What is Custom Manufactured Fr-4 Single-Sided Wireless Bluetooth Speaker Main Control Board PCB Audio Device Mass Prodcution Revcerse Engineering No MOQ

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$2.78-4.69 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Flame Retardant Properties V0
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Processing Technology Delay Pressure Foil
  • Application Consumer Electronics
  • Mechanical Rigid Rigid
  • Material Aluminum
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Board Material Aluminum
  • Board Layer 1
  • Board Thickness 1.0 mm
  • Copper Thickness 2 Oz
  • Min. Hole Size 0.20 mm
  • Min Line Width&Space 0.15 mm
  • Solder Mask White/Black
  • Silksreen Black/ White
  • Surface Fnishing OSP
  • Lead Time 5-6 Working Days

Product Description

Custom Manufactured FR-4 Single-Sided Wireless Bluetooth Speaker Main Control Board PCB Audio Device Mass Prodcution Revcerse engineering NO MOQ Fastlinepcb manufacturing PCBA Technology: 1) Professional Surface-mounting and Through-hole soldering Technology 2) Various sizes like 1206,0805,0603 ...

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Speaker Main Control Board PCB Comparison
Transaction Info
Price US$2.78-4.69 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
Quality Control
Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Delay Pressure Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Board Material: Aluminum;
Board Layer: 1;
Board Thickness: 1.0 mm;
Copper Thickness: 2 Oz;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Solder Mask: White/Black;
Silksreen: Black/ White;
Surface Fnishing: OSP;
Lead Time: 5-6 Working Days;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 1060 Core (1.4mm);
Thermal Conductivity: 3W/M·K (Dielectric Layer);
Copper Foil: 35μm;
Tg: 130°c;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 1060 Core (1.4mm);
Thermal Conductivity: 3W/M·K (Dielectric Layer);
Copper Foil: 35μm;
Tg: 130°c;
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.4mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 35μm;
Tg: 130°C;
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.4mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 35μm;
Tg: 130°C;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier