| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Stainless Steel, Fiberglass Epoxy;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin, Epoxy Resin;
Usage: Commercial Refrigerator & Freezer;
Parts: Condenser;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Min Pad: +/- 0.1mm (4mil);
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Test: Fly Probe Testing;
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flexible PCB;
PCB Material: Fr-4, Cem-1, Cem-3, Aluminum, FPC, Rogers, Isola 3;
Layer: 1- 32 Layers;
Board Thickness: 0.3mm-4mm;
Surface Finish: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
Copper Thickness: 18um-210um(6oz);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow, etc;
PCB Standard: Ipc-a-610, Ipc-a-620;
Certificates: ISO9001, ISO14001, IATF 16949, ISO 13485;
Profiling Punching: Routing, V-Cut, Beveling;
OEM Services: PCBA, PCBA Aassembly: SMT & Pth & BGA;
ODM Services: PCB Design, PCB Layout, PCB Clone;
EMS Services: PCB Prototype, PCB Reverse Engineering;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Tes;
Other Services: Chip Programming & Function Test, Gluing, Conforma;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Gold Plating Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Gold Plating Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Gold Plating Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
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