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FPCB
US$4.35-7.22 / Piece
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What is FPC Manufacture Multilayer Rigid Flex Printed Circuit Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$4.35-7.22 / Piece

Sepcifications

  • Type Rigid Flexible PCB
  • Flame Retardant Properties V0
  • Dielectric Fr4
  • Base Material Fr4+Pi
  • Insulation Materials Epoxy Resin
  • Processing Technology Electrolytic Foil
  • Application Consumer Electronics
  • Mechanical Rigid Rigid
  • Material Fr4+Pi
  • Transport Package Vacuum+Carton Packing
  • Specification UL, SGS, ROHS
  • Trademark Fastline
  • Origin China
  • Board Material Fr4+Pi
  • Board Thickness 1.6mm Rigid and 0.1mm Flex
  • Copper Thickness 0.5oz
  • Min. Hole Size 0.25mm
  • Min. Line Width 0.15mm
  • Min. Line Spacing 0.15mm
  • Surface Finishing Immersion Gold
  • Lead Time 5-7 Working Days
  • Solder Mask Green + Yellow
  • PCB Name FPC Manufacture Rigid Flex Printed Circuit Board

Product Description

FPC Manufacture Multilayer Rigid Flex Printed Circuit Board Hi buyer, Thank your for scanning our Rigid-Flex PCB Products. As is known,PCB is customized product ,so the unit price is not real,details pls contact me and a quotation will be offered.Please send us PCB files in gerber files, ...

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FPCB Comparison
Transaction Info
Price US$4.35-7.22 / Piece US$0.10-1.50 / Piece US$0.10-1.50 / Piece US$0.10-1.50 / Piece US$0.10-1.50 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T T/T T/T
Quality Control
Management System Certification - ISO14001, Others ISO14001, Others ISO14001, Others ISO14001, Others
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Flexible PCB;
Flame Retardant Properties: V0;
Dielectric: Fr4;
Base Material: Fr4+Pi;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Fr4+Pi;
Board Material: Fr4+Pi;
Board Thickness: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Surface Finishing: Immersion Gold;
Lead Time: 5-7 Working Days;
Solder Mask: Green + Yellow;
PCB Name: FPC Manufacture Rigid Flex Printed Circuit Board;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier