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Fr4 PCB
US$4.89-6.75 / Piece
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What is Bluetooth Audio Amplifier Board PCB Circuit Board PCB Assembly for Electronic

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$4.89-6.75 / Piece

Sepcifications

  • Structure Double-Sided Rigid PCB
  • Dielectric FR-3
  • Material Phenolic Paper Laminate
  • Application Computer
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Semi-Additive Process
  • Base Material Fr4
  • Insulation Materials Organic Resin
  • Transport Package Vacuum Packing
  • Specification IP class -2
  • Trademark Fastline
  • Origin Shenzhen, China
  • Board Material Fr4
  • Layers 1 to 30 Layers
  • Board Thickness 1.6mm
  • Copper Thickness 1oz
  • Solder Mask Green
  • Silk Screen White
  • Surface Treatment HASL Lead Free
  • Test 100%
  • Lead Time 6-8 Working Days
  • Min. Line Width 0.075mm

Product Description

Bluetooth Audio Amplifier Board pcb circuit board pcb Assembly for electronic Product Description Fastline PCB's aim Customer Satisfaction is Always Our First Priority! *Quality Policy *Top ...

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Fr4 PCB Comparison
Transaction Info
Price US$4.89-6.75 / Piece US$0.01-100.00 / Piece US$0.10-10.00 / Piece US$0.10-10.00 / Piece US$0.10-10.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Double-Sided Rigid PCB;
Dielectric: FR-3;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper, PP;
Insulation Materials: Epoxy Resin;
Brand: Kb, Shenyi, Rogers, Iteq;
Layer: 1-20 Layers;
Raw Material: Fr-4, Cu Base, High Tg Fr-4, PTFE, Rogers, Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Minimum Line/Space: 0.075mm;
Impedance Control Tolerance: +/-10%;
Surface Finish/Treatment: HASL, Enig, Chem, Tin, Flash Gold, OSP, Gold Finger;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Copper Thickness: 1 Oz;
Board Layer: 2 Layers;
Board Thickness: 1.6mm;
Surface Finish: Gold Plating,Enig;
Solder Mask: Green;
Legend: White;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Copper Thickness: 1 Oz;
Board Layer: 2 Layers;
Board Thickness: 1.6mm;
Surface Finish: Gold Plating,Enig;
Solder Mask: Green;
Legend: White;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier