| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: OSP;
Lead Time: 6-8 Working Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Okey;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum, Copper Base;
Board Thickness: 0.4-5.0mm;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil;
Min. SMD Size: 01005;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Order Qty: Not Limited;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Service: Turnkey Assembly PCB PCBA Service;
Customized: Customizable;
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Type: PCB;
Dielectric: 1-32 Layers;
Material: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid / Flex / Rigid-Fle;
Processing Technology: HASL / Enig / OSP / Immersion Silver / Tin;
Base Material: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Insulation Materials: Green / Black / White / Red / Blue / Yellow;
Brand: Kq;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Surface Finishing: HASL / Enig / OSP / Immersion Silver / Tin;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Copper Thickness / Board Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Condition: New;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Wonderwing;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Customized;
Service: PCB+Assembly+Components;
Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
Technical Support: Free Dfm/a Check, Bom Analysis;
Product Name: Industrial Equipment PCBA;
Placement Precision: ±0.03mm / ±0.01mm (Chip);
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