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PCB
US$7.02-7.03 / Piece
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What is High Quality Shenzhen Electronics Flexible PCB Board FPCB Circuit Board Process

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$7.03

1,000-9,999 Pieces US$7.026

10,000+ Pieces US$7.02

Sepcifications

  • Structure Multilayer FPC
  • Material Fiberglass Epoxy, Polyester Film
  • Combination Mode Adhesive Flexible Plate
  • Application Aviation and Aerospace, Consumer Electronics
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V2, V0
  • Processing Technology Delay Pressure Foil, Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Type Rigid Circuit Board
  • Mechanical Rigid Rigid
  • Dielectric Fr4 and Polyimide, Fr-4
  • Board Material Fr4 and Polyimide
  • Board Layer 2 Layer Rigide and 2 Layer Flex
  • Copper Thickness 1 Oz
  • Min. Line Space 0.05mm (2mil)
  • Min Conductor Width 0.05mm(2mil)
  • Min.Hole Size 0.075mm (3mil)
  • Surface Finishing Enig, Immersion Tin, Immersion Gold. OSP
  • Lead Time 5-6 Working Days
  • PCB Design Customer Provided
  • Board Thickness 0.1mm
  • Min Pad +/-0.1mm (4mil)
  • Outline Machining Accuracy +/-0.1mm (4mil)

Product Description

High Quality Flexible PCB Board Flexible PCB circuit Board Process Fastline could produce 1-26 layers PCB board for electronic products, providing PCB design, PCB fabrication, PCB clone, and PCB assembly services. and we have got the UL, ISO, SGS certifications. Please see our PCB catalog ...

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PCB Comparison
Transaction Info
Price US$7.02-7.03 / Piece US$0.10-1.00 / Piece US$2.89 / Piece US$2.89 / Piece US$2.89 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T LC, T/T, D/P, Western Union, PayPal, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment
Quality Control
Product Certification - ISO9001, ISO14001, ISO13485, Ts-16949, etc - - -
Management System Certification - ISO14001, Others - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Southeast Asia/ Mideast Southeast Asia/ Mideast Southeast Asia/ Mideast
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM, OEM Own Brand Own Brand Own Brand
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Fiberglass Epoxy, Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Aviation and Aerospace, Consumer Electronics;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2, V0;
Processing Technology: Delay Pressure Foil, Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Dielectric: Fr4 and Polyimide, Fr-4;
Board Material: Fr4 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 1 Oz;
Min. Line Space: 0.05mm (2mil);
Min Conductor Width: 0.05mm(2mil);
Min.Hole Size: 0.075mm (3mil);
Surface Finishing: Enig, Immersion Tin, Immersion Gold. OSP;
Lead Time: 5-6 Working Days;
PCB Design: Customer Provided;
Board Thickness: 0.1mm;
Min Pad: +/-0.1mm (4mil);
Outline Machining Accuracy: +/-0.1mm (4mil);
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard Board;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design, Engineering Support, Testing;
Specialised: Medical, Industrial, Communication, Controlboard;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test), 40X Om;
Surface Finishing: Enig, OSP, AG, Immersion Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black, Yellow, Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Board Size: Custom Made FPC;
Min. Line Width: 0.05 mm;
Surface Finishing: OSP;
Type: Flat Flexible FPC Cable;
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Board Size: Custom Made FPC;
Min. Line Width: 0.05 mm;
Surface Finishing: OSP;
Type: Flat Flexible FPC Cable;
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Board Size: Custom Made FPC;
Min. Line Width: 0.05 mm;
Surface Finishing: OSP;
Type: Flat Flexible FPC Cable;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier