| Specification |
Dielectric: Aluminium Base PCB;
Board Material: Aluminum;
Board Layer: 1;
Board Thickness: 1.0 mm;
Copper Thickness: 2 Oz;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Solder Mask: White/Black;
Silksreen: Black/ White;
Lead Time: 5-6 Working Days;
Surface Finish: OSP, Immersion Gold, Immersion Tin;
Hole Size Tolerance (Npth): +/- 2 Mils (+/- 0.05 mm);
Minimum Pad-to-Pad Tol.: +/-3 Mils (+/-; 0.76 mm);
Impedance Control: +/-10% (Differential);
Aspect  Ration : 16:1;
MOQ: 1 PCS;
|
Dielectric: Aln , Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
|
Dielectric: Aln, Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
|
Dielectric: Aln, Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
|
Dielectric: Aln, Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
|