| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Treatment: Immersion Gold;
Layers: 1-50layers;
Soldermask: Green, Blue, White, Red, Black, etc.;
Silkscreen: Green, Blue, White, Red, Black, etc.;
Mini Holes: 0.1mm;
Mini Trace: 3 Mil/ 3 Mil;
MOQ: 1PCS;
Test: 100%;
Service: One-Stop;
Supply: Fast;
File: PCB File;
Lead Time: 5-6 Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thickness: 4.0mm;
Special Material: Fr5;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Soldermask: Blue,Green,White,Black,Yellow,Red;
Silkscreen: White,Black;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Copper Thickness: 1oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: Fr4;
Copper Thickness: 25um;
Board Thickness: 1.2mm;
Min. Hole Size: 0.1mm;
Min. Line Width: 0.25mm;
Min. Line Spacing: 0.25mm;
Surface Finishing: OSP;
Layer: 4;
Solder Mask: Green;
Legend Mask: White;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Base Material: Fr4;
Layer: 4L;
Surface Finishing: Lf-Hal;
Copper Thickness: 25um;
Board Thickness: 1.6mm;
Min. Hole Size: 0.15mm;
Min. Line Wigth: 0.25mm;
Min. Line Spacing: 0.25mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Base Material: Fr4;
Surface Finishing: Hf-HASL;
Copper Thickness: 35um;
Board Thickness: 1.6mm;
Min. Hole Size: 0.15mm;
Min. Line Wigth: 0.25mm;
Min. Line Spacing: 0.25mm;
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