| Specification |
Type: Fr4;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 2 Layer;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Finishing: Immersion Gold;
Solder Mask Type: Green;
Silkscreen: White;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.1mm;
Min. Line Spacing: 0.1mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: CEM-1;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Surface Finishing: HASL;
Copper Thickness: 35um;
Board Thickness: 1.6mm;
Min. Hole Size: 0.1mm;
Min. Line Wigth: 0.075mm;
Min. Line Spacing: 0.075mm;
Layer: 1 to 18;
Package: Vacuum;
Shipping: UPS, FedEx, DHL, Ect;
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Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.20mm-8.00mm;
Maximum Size: 600mmx1200mm;
Board Outline Tolerance: +0.10mm;
Thickness Tolerance(T≥0.8mm): +-8%;
Thickness Tolerance(T<0.8mm): +-8%;
Surface Finishing: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Finishing: Immersion Gold;
Solder Mask Type: Green;
Silkscreen: White;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.1mm;
Min. Line Spacing: 0.1mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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