| Specification |
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
PCB Layer: 1-26 Layers;
SMT Line Quantity: : 30;
Solder Mask: Any;
Silk Screen: Any;
Surface Treatment: HASL;
PCB Assembly Type: SMT and DIP;
PCB Service: One Stop Service;
Small Orders: 1 PCS Is Ok;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Board Dimensions: Smallest Size: 50*50mm;
BGA-Min Pitch: 0.25mm;
Testing Procedures: Visual Inspection ; X-ray Inspection ;Aoi (Automat;
Board Shape: Rectangular ; Round ;Slots and Cut Outs; Complex a;
Lead Time: 12-20 Days;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Medical Instruments;
Test: Flying Probe and Fixture;
Solder Mask: Green;
Board Thickness: 0.8mm / 1.6mm Custom;
Custom: OEM / ODM / Custom;
Copper: 0.5oz / 18um, 2oz / 70um;
Legend: White;
Surface Finish: Enig;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
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