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PCB Assembly for USB Charger Offer Printed Circuit Board Assembly Service

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$4.35-7.22 / Piece

Sepcifications

  • Metal Coating Copper
  • Mode of Production SMT
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, ISO, UL
  • Customized Customized
  • Condition New
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Board Material Fr4
  • Board Layer 4
  • Board Thickness 1.6mm
  • Copper Thickness 1 Oz
  • Min. Line Width/Space 0.1mm
  • Min. Hole Size 0.2mm
  • Solder Mask Green/Blue/Red
  • Silkscreen White/ Black
  • Lead Time 8-10 Working Days
  • Board Dimensions Smallest Size :50*50mm
  • SMT Line Quantity 30
  • Design File Format Gerber RS-274X
  • Testing Procedures  Visual Inspection, Aoi
  • Surface Finishing Immersion Gold
  • Board Shape Rectangular, Round

Product Description

PCB assembly for USB charger offer printed circuit board assembly service Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Please see our pcb ...

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Printed Circuit Board Assembly Comparison
Transaction Info
Price US$4.35-7.22 / Piece US$0.30-2.00 / Piece US$0.30-2.00 / Piece US$0.68-10.80 / Piece US$0.68-10.80 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment PayPal, T/T PayPal, T/T
Quality Control
Product Certification RoHS, ISO, UL RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Europe North America, Europe
Annual Export Revenue - - - - -
Business Model - - - ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Material: Fr4;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Solder Mask: Green/Blue/Red;
Silkscreen: White/ Black;
Lead Time: 8-10 Working Days;
Board Dimensions: Smallest Size :50*50mm;
SMT Line Quantity: 30;
Design File Format: Gerber RS-274X;
Testing Procedures : Visual Inspection, Aoi;
Surface Finishing: Immersion Gold;
Board Shape: Rectangular, Round;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

China Dragon Electronic Industrial Co., Limited

Diamond Member Audited Supplier

China Dragon Electronic Industrial Co., Limited

Diamond Member Audited Supplier