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Rigid-Flex PCB Circuit Board
US$0.36-0.78 / Piece
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What is High Technology Rigid-Flex PCB Circuit Board with Fast Prototype

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.78

1,000-4,999 Pieces US$0.56

5,000-9,999 Pieces US$0.46

10,000+ Pieces US$0.36

Sepcifications

  • Dielectric Fr4 and Polyimide
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Board Material Fr4 and Polyimide
  • Board Layer 2 Layer Rigide and 2 Layer Flex
  • Copper Thickness 1 Oz
  • Min. Line Space 0.05mm (2mil)
  • Min Conductor Width 0.05mm(2mil)
  • Min.Hole Size 0.075mm (3mil)
  • Solder Mask Any Color
  • Silkscreen Any Color
  • Surface Finishing Enig, Immersion Tin, Immersion Gold. OSP
  • Lead Time 5-6 Working Days
  • PCB Design Customer Provided
  • Board Thickness 0.1mm
  • Min Pad +/-0.1mm (4mil)
  • Outline Machining Accuracy +/-0.1mm (4mil)
  • MOQ 1 PCS

Product Description

High Technology Rigid-Flex PCB Circuit Board with Fast Prototype Fastline could produce 1-26 layers PCB board for electronic products, providing PCB design, PCB fabrication, PCB clone, and PCB assembly services. and we have got the UL, ISO, SGS certifications. Please see our PCB catalog ...

Learn More

Rigid-Flex PCB Circuit Board Comparison
Transaction Info
Price US$0.36-0.78 / Piece US$2.88-5.88 / Piece US$2.88-5.88 / Piece US$2.88-5.88 / Piece US$2.88-5.88 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal LC, T/T, PayPal LC, T/T, PayPal LC, T/T, PayPal
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea) North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea) North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea) North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea)
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month, 1-3 months
Off Season Lead Time: within 15 workdays, one month, 1-3 months		 Peak Season Lead Time: within 15 workdays, one month, 1-3 months
Off Season Lead Time: within 15 workdays, one month, 1-3 months		 Peak Season Lead Time: within 15 workdays, one month, 1-3 months
Off Season Lead Time: within 15 workdays, one month, 1-3 months		 Peak Season Lead Time: within 15 workdays, one month, 1-3 months
Off Season Lead Time: within 15 workdays, one month, 1-3 months
Product Attributes
Specification
Dielectric: Fr4 and Polyimide;
Board Material: Fr4 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 1 Oz;
Min. Line Space: 0.05mm (2mil);
Min Conductor Width: 0.05mm(2mil);
Min.Hole Size: 0.075mm (3mil);
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Enig, Immersion Tin, Immersion Gold. OSP;
Lead Time: 5-6 Working Days;
PCB Design: Customer Provided;
Board Thickness: 0.1mm;
Min Pad: +/-0.1mm (4mil);
Outline Machining Accuracy: +/-0.1mm (4mil);
MOQ: 1 PCS;
Dielectric: Aln, Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
Dielectric: Aln, Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
Dielectric: Aln, Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
Dielectric: Aln, Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Adena Ceramics International LLC (Shanghai)

Gold Member Audited Supplier

Adena Ceramics International LLC (Shanghai)

Gold Member Audited Supplier

Adena Ceramics International LLC (Shanghai)

Gold Member Audited Supplier

Adena Ceramics International LLC (Shanghai)

Gold Member Audited Supplier