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PCB
US$0.86-2.48 / Piece
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What is Professional Reverse Engineering PCB Service Electronics Circuit Board Fabrication PCB

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.86-2.48 / Piece

Sepcifications

  • Structure 8 Layer
  • Dielectric FR-4
  • Material Fr4
  • Application Communication
  • Flame Retardant Properties HB
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Fr4
  • Insulation Materials Organic Resin
  • Brand FL
  • Transport Package Vacuum Packing
  • Specification Certificates: UL, ROHS
  • Trademark FL
  • Origin China
  • Board Material Fr-4 (Tg 135 )
  • Board Thickness 1.6 mm
  • Copper Thickness 1 Oz (35um)
  • Surface Treatment Immersion Gold
  • Solder Mask Green
  • Silk Screen White
  • Flying Probe Test Yes
  • Product Name Immersion Gold Circuit Board Multilayer PCB
  • Test Aoi X-ray

Product Description

Professional Reverse Engineering PCB Service Electronics Circuit Board Fabrication PCB Features-Our Products Advantage 1. Over 10 years experience manufacturer in PCB &PCBA service field. 2. Big scale of producing makes sure that your purchase cost is lower. 3. Advanced ...

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PCB Comparison
Transaction Info
Price US$0.86-2.48 / Piece US$30.00-50.00 / Piece US$0.20-0.50 / Piece US$0.50-1.00 / Piece US$1.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: 8 Layer;
Dielectric: FR-4;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: FL;
Board Material: Fr-4 (Tg 135 );
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: Immersion Gold;
Solder Mask: Green;
Silk Screen: White;
Flying Probe Test: Yes;
Product Name: Immersion Gold Circuit Board Multilayer PCB;
Test: Aoi X-ray;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Layer: 16;
Thickness: 1.82mm;
Surface: Enig;
Vias: 0.1mm;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finish: Immersion/ Chemical Gold 3u'';
Finished Copper Thickness: Thick Copper: 4oz;
Overall Board Thickness: 6.0mm;
Size: 160*146.8mm;
Structure: Rigid-Flex;
Dielectric: Polyimide&Fr4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide&Fr4;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer: 12;
Thickness: 1.5mm;
Min Hole: 0.18mm;
Surface: Enig;
Soldmask: Green;
Min Space: 0.15mm;
Min Hole Copper: 25um;
Hole Qty: 2000;
Siz: 250mm*300mm;
Used: Power;
Structure: Rigid-Flex;
Dielectric: Polyimide&Fr4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide&Fr4;
Insulation Materials: Epoxy Resin;
Brand: UC;
Layer: 20;
Thickness: 3.0mm;
Min Hole: 0.45mm;
Surface: Enig;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier