| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Delay Pressure Foil;
Application: Communication;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Board Material: Copper;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: White;
Silksreen: Black;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
|
Type: Rigid Circuit Board;
Base Material: Copper;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Silkscreen Color: White/Green/Black/Red Customized;
Board Color: White/Green/Black/Red/Blue Customized;
Min Track and Spacing: ≥3/3mil(0.076mm);
Min Network Track and Spacing: ≥6mil/8mil(0.15/0.20mm);
Min Hole(Drilling Machine): Min 0.2mm, Tolerance ±0.075mm;
Min Slot(Drilling Machine): 0.6mm, Tolerance±0.1mm;
Surface Treatment: HASL, HASL Lead Free, Enig, Immersion AG, Immersio;
Thermal Conductivity: 1.0 / 1.5 / 2.0 / 3.0 W/M·K Available;
Min Width: ≥0.6mm;
Min Height: ≥0.8mm;
Min Line Width: ≥0.1mm;
Spacing Between Solarmask and SMT Square: ≥0.2mm;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: PP;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Customized;
Copper: 1oz, 2oz, 3oz, 35um, 70um;
Thermal Conductivity: 1W/M.K, 1.5W/M.K, 2W/M.K;
Thickness: 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm;
Surface Finish: OSP, HASL, HASL Lf;
|
Type: Rigid Circuit Board;
Base Material: Copper;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Silkscreen Color: White/Green/Black/Red Customized;
Board Color: White/Green/Black/Red/Blue Customized;
Min Track and Spacing: ≥3/3mil(0.076mm);
Min Network Track and Spacing: ≥6mil/8mil(0.15/0.20mm);
Min Hole(Drilling Machine): Min 0.2mm, Tolerance ±0.075mm;
Min Slot(Drilling Machine): 0.6mm, Tolerance±0.1mm;
Surface Treatment: HASL, HASL Lead Free, Enig, Immersion AG, Immersio;
Thermal Conductivity: 1.0 / 1.5 / 2.0 / 3.0 W/M·K Available;
Min Width: ≥0.6mm;
Min Height: ≥0.8mm;
Min Line Width: ≥0.1mm;
Spacing Between Solarmask and SMT Square: ≥0.2mm;
|
Type: Rigid Circuit Board;
Base Material: Copper;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Silkscreen Color: White/Green/Black/Red Customized;
Board Color: White/Green/Black/Red/Blue Customized;
Min Track and Spacing: ≥3/3mil(0.076mm);
Min Network Track and Spacing: ≥6mil/8mil(0.15/0.20mm);
Min Hole(Drilling Machine): Min 0.2mm, Tolerance ±0.075mm;
Min Slot(Drilling Machine): 0.6mm, Tolerance±0.1mm;
Surface Treatment: HASL, HASL Lead Free, Enig, Immersion AG, Immersio;
Thermal Conductivity: 1.0 / 1.5 / 2.0 / 3.0 W/M·K Available;
Min Width: ≥0.6mm;
Min Height: ≥0.8mm;
Min Line Width: ≥0.1mm;
Spacing Between Solarmask and SMT Square: ≥0.2mm;
|
