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High Precision PCB
US$0.21-0.38 / Piece
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What is High Precision PCB Board with Component Sourcing and Assembly

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$0.38

100-999 Pieces US$0.29

1,000-9,999 Pieces US$0.25

10,000+ Pieces US$0.21

Sepcifications

  • Structure Double-Sided Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties HB
  • Processing Technology Electrolytic Foil
  • Production Process Semi-Additive Process
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Brand Fastline
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Board Layer 2
  • Board Thickness 1.6mm
  • Copper Thickness 2oz
  • Min Hole 0.15mm
  • Min Trace 0.15mm
  • Lead Time 4-5 Working Days

Product Description

High Precision PCB Board with Component Sourcing and Assembly Fastline Circuits is capable of providing full turnkey and partial turnkey printed circuit board assembly services. For full turnkey, we take care of the entire process, including preparatio n of Printed Circuit Boards, procurement ...

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High Precision PCB Comparison
Transaction Info
Price US$0.21-0.38 / Piece US$1.00 / Piece US$1.10-1.70 / Piece US$2.80-3.60 / Piece US$2.00-3.50 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Fastline;
Board Layer: 2;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Min Hole: 0.15mm;
Min Trace: 0.15mm;
Lead Time: 4-5 Working Days;
Structure: Rigid-Flex;
Dielectric: Polyimide&Fr4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide&Fr4;
Insulation Materials: Epoxy Resin;
Brand: UC;
Layer: 20;
Thickness: 3.0mm;
Min Hole: 0.45mm;
Surface: Enig;
Structure: Rigid-Flex;
Dielectric: Polyimide&Fr4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide&Fr4;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer: 8;
Thickness: 2.0mm;
Hole: 03mm;
Surface: Enig;
Structure: Rigid-Flex;
Dielectric: Polyimide&Fr4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide&Fr4;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer: 4;
Thickness: 0.55mm;
Hole: 0.3mm;
Surface: Enig;
Structure: Rigid-Flex;
Dielectric: Polyimide&Fr4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide&Fr4;
Insulation Materials: Epoxy Resin;
Brand: UC;
Layer: 4;
Thickness: 0.4mm;
Surface: Enig;
Space: 0.12mm;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier