| Specification |
Insulation Materials: Organic Resin;
Flame Retardant Properties: HB;
Application: Aerospace;
Board Material: Fr4 and Polyimide;
Board Layer: 1-26 Layers;
Copper Thickness: 1 Oz;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Gold Plate;
Max PCB Size: 650*650mm;
Testing: 100%;
Packaging: Carton + Vacuum;
Board Shape: Rectangular ; Round ;Slots and Cut Outs; Complex a;
BGA-Min Pitch: 0.25mm;
PCB Service: One Stop Service;
Dielectric: Fr4 and Polyimide;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Medical Instruments;
Test: Flying Probe and Fixture;
Solder Mask: Green;
Board Thickness: 0.8mm / 1.6mm Custom;
Custom: OEM / ODM / Custom;
Copper: 0.5oz / 18um, 2oz / 70um;
Legend: White;
Surface Finish: Enig;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
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