| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
PCB Layer: 1-26 Layers;
SMT Line Quantity: : 30;
Solder Mask: Any;
Silk Screen: Any;
Surface Treatment: HASL;
PCB Assembly Type: SMT and DIP;
PCB Service: One Stop Service;
Small Orders: 1 PCS Is Ok;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Board Dimensions: Smallest Size: 50*50mm;
BGA-Min Pitch: 0.25mm;
Testing Procedures: Visual Inspection ; X-ray Inspection ;Aoi (Automat;
Board Shape: Rectangular ; Round ;Slots and Cut Outs; Complex a;
Lead Time: 12-20 Days;
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Structure: Metal Base Rigid PCB;
Material: Aluminium;
Flame Retardant Properties: V0;
Production Process: Subtractive Process;
Base Material: Aluminum;
Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm;
Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K;
Ccl Brand: Jh,Ccaf.etc;
Sample Date: 3-5days;
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Structure: Metal Base Rigid PCB;
Material: Aluminium;
Production Process: Subtractive Process;
Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm;
Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K;
Ccl Brand: Jh,Ccaf.etc;
Sample Date: 3-5days;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer: 6;
Thickness: 2+/-0.18mm;
Surface: Enig;
Trace: 0.25mm/0.18mm;
QA: Ipc-3;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Power Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Layer Count: 4 Layers;
Board Thickness: 2.0+/-0.2mm;
Min Hole: 0.3mm;
Solder Mask Color: Green;
Surface Treatment: Enig;
Cooper Thickness: All 1 Oz;
PCB Testing: E-Testing, Flying Probe Testing;
Ipc Standards: Ipc Class II;
Lead Time: 7 Working Days;
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