| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Min. Line Width/Space: 0.05mm;
Min. Hole Size: 0.05mm;
Board Material: Fr4;
Test: Aoi Test;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
Service: PCB Prototype, Compoments Sourcing, PCB Assembly;
Layer: 1-32 Layers;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Mc PCB, Rogers, Isol;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flexible PCB;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irreg;
Board Thickness: 0.3mm-4mm;
Max.Finished Board Size: 22inch*22inch or 550mm*550mm;
Surface Finish/Treatment: Hal/HASL Lf, Chemical Tin, Enig, OSP;
Copper Thickness: 18um-210um(6oz);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow, etc;
Profiling Punching: Routing, V-Cut, Beveling;
Standard: ANSI/ESD, Ipc-a-610, Ipc-a-620;
Placement: Qfp, Sop, Plcc, BGA;
SMT: 1206, 0805, 0603, 0402, 0201, 01005;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-210um(6oz);
Service: OEM/ODM, EMS;
Materials: Fr-4/Fr-4tg170//Aluminum-Based Materials;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Offer Service: PCBA Prototype, PCBA Debugging, PCBA ODM (Project;
Standard/ Certificate: ISO9001, ISO14001, IATF16949;
Profiling Punching: Routing, V-Cut, Beveling;
Assembly Service: PCB Manufacturing, Components Sourcing;
OEM: PCBA, PCBA Aassembly: SMT & Pth & BGA;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functiona;
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