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High Quality Flexible PCB Prototyping Circuit Board

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.69

1,000-4,999 Pieces US$0.62

5,000-9,999 Pieces US$0.56

10,000+ Pieces US$0.50

Sepcifications

  • Structure Multilayer FPC
  • Material Polyimide
  • Combination Mode Without Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties HB
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Brand Fastline
  • Transport Package Vacuum+Carton Packing
  • Specification UL, SGS, ROHS
  • Trademark FL
  • Origin China
  • Board Material Polyimide
  • Board Thickness 1.6 mm
  • Copper Thickness 1 Oz (35um)
  • Surface Treatment HASL Lead Free
  • Service High Quality
  • Lead Time 5-10 Days
  • Small Order Accepted
  • Test 100% Test
  • PCB Type Rigid-Flexible PCB
  • Silk Screen White

Product Description

High quality Flexible PCB Prototyping Circuit Board Product description: production line PCB Manufacture Capability Item Manufacture Capability Layers 1-26 Layers HDI 2+N+2 Material Types Fr-4, Fr-5, High-Tg, Aluminum Based ,Halogen Free, ...

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PCB Production Comparison
Transaction Info
Price US$0.50-0.69 / Piece US$0.01-10.00 / pcs US$0.01-20.00 / pcs US$0.01-150.00 / Piece US$0.01-10.00 / Piece
Min Order 1 Piece 1 pcs 1 pcs 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Fastline;
Board Material: Polyimide;
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
Service: High Quality;
Lead Time: 5-10 Days;
Small Order: Accepted;
Test: 100% Test;
PCB Type: Rigid-Flexible PCB;
Silk Screen: White;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layers: 1~8 Layers;
Board Thickness: 0.2mm;
Copper Thickness: 35 Um;
Surface Finish: Enig;
Outline: Module Punch;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.2mm;
Copper Thickness: 35um;
Surface Finish: Immersion Gold;
Solder Mask: Coverlay;
Legend: Without;
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Computer with LCD Screen;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Flex Board: 1-8 Layer;
Flex-Rigid Board: 2-10layer;
Materials: Pi, Pte, Pen, Fr-4;
Solder Mask: Yellow;
Min Slot: 24mil X 35mil;
Copper Thickness: 1/3oz - 2oz;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Maximum Size: 600mmx1200mm;
Board Outline Tolerance: +0.10mm;
Insulation Layer Thickness: 0.075mm--5.00mm;
Minimum Line: 0.075mm;
Impedance Control Tolerance: +-10%;
Surface Finishing: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier