| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: FL;
Board Material: Fr4, Bt HDI;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 2 Oz;
Max PCB Size: 1200*500mm;
Min Hole Size: 0.075mm (3mil);
Min Conductor Spacing: 0.05mm (2mil);
Min Conductor Width: 0.05mm (2mil);
Surface Finishing: Enig, Immersion Gold, Immersion Tin, OSP;
Min Board Thickness: Single and Double Sized Is 0.1mm;
Min Pad: +/-0.1mm (4mil);
Lead Time: 4-5 Working Days;
Solder Mask: Any;
MOQ: 1 PCS;
Packing: Vacuum and Carton;
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Type: Printed Circuit Board Assembly;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industrial Control;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Yuwei;
Product Name: PCB PCBA;
Keywords: Circuit Board PCBA;
Surface Finishing: Enig, Enepig, HASL,OSP, Gold Finger etc;
Board Thickness: 0.2 mm-6.5 mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.3mm;
Layer Count: 1-50;
|
Type: Printed Circuit Board Assembly;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industrial Control;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Yuwei;
Product Name: PCB PCBA;
Keywords: Circuit Board PCBA;
Surface Finishing: Enig, Enepig, HASL,OSP, Gold Finger etc;
Board Thickness: 0.2 mm-6.5 mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.3mm;
Layer Count: 1-50;
|
Type: Printed Circuit Board Assembly;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industrial Control;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Yuwei;
Product Name: PCB PCBA;
Keywords: Circuit Board PCBA;
Surface Finishing: Enig, Enepig, HASL,OSP, Gold Finger etc;
Board Thickness: 0.2 mm-6.5 mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.3mm;
Layer Count: 1-50;
|
Type: Printed Circuit Board Assembly;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industrial Control;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Yuwei;
Product Name: PCB PCBA;
Keywords: Circuit Board PCBA;
Surface Finishing: Enig, Enepig, HASL,OSP, Gold Finger etc;
Board Thickness: 0.2 mm-6.5 mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.3mm;
Layer Count: 1-50;
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