| Specification |
Insulation Materials: Organic Resin;
Flame Retardant Properties: HB;
Application: Aerospace;
Board Thickness: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 1oz;
Solder Mask: Green and Yellow;
Silk Screen: White;
Material: Fr4 + Polymide;
PCB Type: Rigid-Flexible PCB;
Test: 100% Test;
Small Order: Accepted;
Lead Time: 5-10 Days;
Service: High Quality;
Dielectric: Fr-4;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V2;
Circuit Board Type: Rigid, Flex;
Standard: 94V0 Circuit Board;
Moisture and Dust Prevention: Conformal Coating;
Testing: Aoi, X-ray, Spi, Fct, Ict;
Programming: Support;
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