| Specification |
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Exceeding;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Technology: Immersion Silver, Immersion Tin.;
Keyword: Custom PCB;
Product Name: Rigid PCB;
MOQ: 1PCS;
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Structure: Multilayer Rigid PCB;
Dielectric: CEM-1;
Material: Polyester Glass Fiber Mat Laminate;
Application: LED;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Copper Thickness: 1oz;
PCB Solder Mask: White;
PCB Silkscreen: Black;
PCB Board Thickness: 1.6mm;
PCB Surface Finishing: HASL;
Min Hole Size: 0.2mm;
Min Line: 0.2mm;
Size: 10-1000mm;
Delivery Time: 1-7days;
Pack: Vacuum Packing;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Solder Mask Type: Green;
Silkscreen: White;
Min. Hole Size: 0.3mm;
Min. Line Width: 0.2mm;
Min. Line Spacing: 0.2mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Surface Finishing: Hf-HASL;
Copper Thickness: 35um;
Board Thickness: 1.2mm;
Min. Hole Size: 0.15mm;
Min. Line Wigth: 0.25mm;
Min. Line Spacing: 0.25mm;
Layer: 2;
Solder Mask: Green;
Legend Mask: White;
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Structure: Multilayer Rigid PCB;
Dielectric: CEM-1;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Solder Mask: White, Green, Black, Red;
Silkscreen: White, Green, Black, Red;
PCB Material Thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 3.2mm;
Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
Copper Thickness: 1oz;
Min Hole Size: 0.2mm;
Min Line Width: 0.1mm;
Min Line Spacing: 0.1mm;
Shipping: UPS, FedEx, DHL, Ect;
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