| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Keyword: Custom PCB;
MOQ: 1 PCS;
Min. Line Spacing: 0.075mm(3mil);
Copper Thickness: 18um-3500um(0.5- 100oz);
Min. Line Width: 0.075mm(3mil);
Min Hole Size: 0.1mm(4mil);
Testing Service: 100% E-Testing;
Board Thickness: 0.2-6.0mm;
Industrial: Industrial Control Board, Motherboard;
Surface Finishing: Immersion Gold/Silver, Tin, HASL Lf, Gold Finger, OSP;
Solder Mask: Green, White, Black, Blue, Red(Customized);
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: Immersion Gold;
Solder Mask: Green;
Silk Screen Color: White;
Board Layer: 1-50;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: FL;
Board Material: Fr4, Bt HDI;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 2 Oz;
Max PCB Size: 1200*500mm;
Min Hole Size: 0.075mm (3mil);
Min Conductor Spacing: 0.05mm (2mil);
Min Conductor Width: 0.05mm (2mil);
Surface Finishing: Enig, Immersion Gold, Immersion Tin, OSP;
Min Board Thickness: Single and Double Sized Is 0.1mm;
Min Pad: +/-0.1mm (4mil);
Lead Time: 4-5 Working Days;
Solder Mask: Any;
MOQ: 1 PCS;
Packing: Vacuum and Carton;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Material: Fr4 Tg150;
Regular Board Thickness: 1.6mm;
Board Layer: 2;
Copper Thickness: 1 Oz;
Max PCB Size: 1200*500mm;
Min Hole Size: 0.075mm(3mil);
Min Trace: 0.05mm(2mil);
Min Conductor Width: 0.05mm(2mil);
Min Board Thickness: 0.1mm;
Min Pad: +/-0.1mm (4mil);
Outline Machining Accuracy: +/-0.1mm (4mil);
Surface Finishing: Enig, OSP, Immersion Gold, Immersion Tin;
Solder Mask: Any;
MOQ: 1PCS;
Lead Time: 4-5 Working Days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Cq;
Board Material: Fr4;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 2 Oz;
Max PCB Size: 650*650mm;
Min Hole: 0.15mm;
Min Trace: 0.15mm;
Surface Finishing: Enig;
Solder Mask: Any;
Lead Time: 4-5 Working Days;
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