| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Alu;
Base Material: Aluminum/Fr4;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: LED Lightintg;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Exceeding;
Surface Finishing: HASL Lf, Enig, OSP, Immersion Au, Silver, Tin;
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 5-10 Days;PCBA, 2-3weeks;
LED Type: 3528/2835/5050/3014/5730/3030;
Thermal Conductivity: 0.8-3W/M.K;
Keyword: LED PCB, Aluminium PCB, Motherboad, Circuit Board;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Board Material: Aluminum Base PCB;
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
Solder Mask: Black/White;
Silkscreen: White/Silkscreen;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: Delay Pressure Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Board Thickness: 1.6mm;
Board Layer: 1 Layers;
Copper Thickness: 1 Oz;
Solder Mask: White;
Silksreen: Glod;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
Small Orders: Accepted;
PCB Service: Complete Service;
PCB Assembly Type: SMT and DIP;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Rogers;
Base Material: Rogers;
Insulation Materials: Organic Resin;
Processing Technology: Delay Pressure Foil;
Application: Communication;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Rogers;
Board Thickness: 0.8 mm;
Board Layer: 1 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
Min. Hole Size: 0.2mm;
Min. Line Width/Space: 0.1mm;
Board Material: Rogers;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Delay Pressure Foil;
Application: Communication;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Board Thickness: 1.6mm;
Board Layer: 1 Layers;
Copper Thickness: 1 Oz;
Solder Mask: White;
Silksreen: Black;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
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