| Specification |
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible P;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
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Structure: Multilayer FPC;
Material: Polyimide;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Layers: Multilayers;
Thickness Board: 2.0mm;
Copper: 1oz;
Surface: Enig;
Solermask: Blue/ White/ Black/ Red/ Green;
Mini Holes: 0.1mm;
Mini Trace: 3 Mil/ 3 Mil;
Supplier: Fast;
MOQ: 1 PCS;
Leading Time: 6-8 Working Days;
Service: One-Stop;
Testing: 100%;
File: PCB File;
Shipping Type: DHL, UPS, FedEx, TNT, EMS etc.;
Payment: Paypal, Tt, Western Union, D/P;
|
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Thickness Board: 2.0mm;
Copper: 1oz;
Surface: Enig;
Solermask: Blue/ White/ Black/ Red/ Green;
Mini Holes: 0.1mm;
Mini Trace: 3 Mil/ 3 Mil;
Supplier: Fast;
MOQ: 1 PCS;
Leading Time: 6-8 Working Days;
Service: One-Stop;
Testing: 100%;
File: PCB File;
Shipping Type: DHL, UPS, FedEx, TNT, EMS etc.;
Payment: Paypal, Tt, Western Union, D/P;
Gerber File: PCB File, Bom;
|
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Thickness Board: 2.0mm;
Copper: 1oz;
Surface: Enig;
Solermask: Blue/ White/ Black/ Red/ Green;
Mini Holes: 0.1mm;
Mini Trace: 3 Mil/ 3 Mil;
Supplier: Fast;
MOQ: 1 PCS;
Leading Time: 6-8 Working Days;
Service: One-Stop;
Testing: 100%;
File: PCB File;
Shipping Type: DHL, UPS, FedEx, TNT, EMS etc.;
Payment: Paypal, Tt, Western Union, D/P;
Gerber File: PCB File, Bom;
|
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Thickness Board: 2.0mm;
Copper: 1oz;
Surface: Enig;
Solermask: Blue/ White/ Black/ Red/ Green;
Mini Holes: 0.1mm;
Mini Trace: 3 Mil/ 3 Mil;
Supplier: Fast;
MOQ: 1 PCS;
Leading Time: 6-8 Working Days;
Service: One-Stop;
Testing: 100%;
File: PCB File;
Shipping Type: DHL, UPS, FedEx, TNT, EMS etc.;
Payment: Paypal, Tt, Western Union, D/P;
Gerber File: PCB File, Bom;
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