| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Dunya;
Intelligent Domain Control: PCB;
Intelligent Networking: PCB;
Intelligent Sense: PCB;
Chassis Power: PCB;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
D/C: Standard;
Condition: New Original;
Warranty: 2 Years;
Mountng Type: SMT ,DIP;
Memory Type: Standard;
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Type: Rigid Circuit Board;
Dielectric: Hydrocarbon/Ceramic/Woven Glass;
Material: Rogers RO4725jxr Laminates;
Application: RF Applications;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: Rogers RO4725jxr Laminates.;
Insulation Materials: Hydrocarbon and Ceramic Materials;
Brand: Rogers;
Solder Mask: Green, Black, Blue, Red, Yellow, White etc.;
Surface Finish: Immersion Gold, HASL, Immersion Silver, Immersion;
Layer Count: Sinlge-Sided PCB, Double-Sided PCB, Multi-Layer PC;
Copper Weight: 1oz (35µm), 2oz (70µm);
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Type: Rigid Circuit Board;
Dielectric: PTFE;
Material: Woven Fiberglass/PTFE Composite;
Application: Digital Radio Antennas;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: Woven Fiberglass/PTFE Composite;
Insulation Materials: PTFE/Fiberglass Composite;
Brand: Rogers;
Solder Mask: Green, Black, Blue, Yellow, Red etc.;
Surface Finish: Immersion Gold, HASL, Immersion Silver, Immersion;
Designation: Diclad 527;
Layer Count: Single Sided, Double Sided, Multi-Layer PCB, Hybri;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kingboard;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Enig Thickness: 1-3u'';
Board Thickness: 0.2-6mm;
Hard Gold Thickness: 1-50u'';
Layers: 1-20layers;
Copper Thickness: 0.5-8oz;
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