| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
PCB Layers: Single Layer, Double Layer, 4 Layers, 6 Layers, 8;
Substrate Material: Fr-4 Tg130, Fr-4 Tg150, Fr-4 Tg180, Aluminum PCB;
Board Thickness: 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 2.4mm;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
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Metal Coating: Tin;
Mode of Production: SMT;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Basic Material: Fr-4;
PCBA Testing: X-ray, Aoi Test, Function Test;
PCBA Min. BGA Pitch: 0.2mm;
Processing Technology: Electrolytic Foil;
Other Service: ODM, OEM, Final Product Assembling;
Insulation Materials: Organic Resin;
Application: Consumer Electronics, Communications, Aerospace;
PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;
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